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China Mobile will develop TD-LTE chips together with VIA Technologies

Updated:2010/10/18 14:25

C114 Oct. 18 News   According to Taiwan media reports, China Mobile will hold "2010 cross-strait summit of 4G technology development and cooperation" in Shanghai on October 20, Wang jianzhou,the chairman of China Mobile,will meet VIA chairman Wang xuehong, the two sides will sign cooperation memorandum to jointly enter the mainland TD-LTE(the fourth generation mobile communication technology) chip market.

As A insider said, at that time Wang jianzhou came to Taiwan and visited HTC, he has signed a cooperation memorandum of TD-SCDMA(the third generation mobile communications of mainland) and TD-LTE terminal products with Wang xuehong. And this time, Wang xuehong will represent a IC design company, GenieNRM, to sign cooperation memorandum with China Mobile. The two sides will jointly develop the chip and expand the cooperation from the downstream to upstream in business.

TD-LTE is Chinese own 4G wireless transmission technology. China Mobile and ITRI(Industrial Technology Research Institute) president Xu juemin invited many domestic industries to participate the 4G summit. The cooperation projects included chips, mobile phones and terminal systems products.

It is understood that with the invitation of China Mobile, Taiwan-based chipmaker VIA Telecom, MediaTek, handset maker HTC, terminal equipments factory Quanta, Gemtek, ZyXEL, Accton, D-Link, MTI, and WiMAX operators FarEasTone, Datong, VMAX, all of their senior leaders will attend the summit.

Except Wang xuehong, MediaTek chairman Cai mingjie and Quanta chairman Lin baili will also meet with Wang jianzhou and rush into chips, mobile phones and TD-LTE terminal products. MediaTek now has produced the mobile phone chip of China Mobile's TD-SCDMA system, the single-quarter shipments are about 3 million to 4 million sets.

By:Nye Sha  Source:C114中国通信网
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