NTT DoCoMo, Renesas, Fujitsu Limited and Sharp are teaming up to develop the SH-Mobile G4 single-chip LSI device and platform to support HSUPA, HSDPA, W-CDMA and GSM/GPRS/EDGE.

The 45 nm platform will provide enhanced functionality and improved performance for applications handling HD video and 3-D graphics. In addition to HSDPA cat.8 for a maximum of 7.2 Mbps downlink speeds, the G4 will support HSUPA to boost uplink speeds to a maximum of 5.7 Mbps.

Four years ago, NTT DoCoMo and Renesas began working on the SH-Mobile G series of single-chip LSI devices, which integrate a baseband processor that supports dual-mode communication and an application processor. The G4 is the fourth product to emerge from this collaboration.

The development work has since progressed to include handset makers such as Fujitsu and Sharp as partners in the development of mobile phone platforms. Each platform has a SH-Mobile G series product as the core component and includes a basic software suite (OS, middleware and drivers) and a reference chipset in a single package.

The companies plan to complete the platform by Q4 2009. Renesas plans to make the platform available to the mobile phone market globally, not just Japanese customers.

Source:WirelessWeek