Foxconn International Holding (FIH) has won the rights to volume produce and sell Qualcomm's Gobi 3G modules, according to industry sources.

Qualcomm introduced Gobi modules, which support both WCDMA/HSPA and CDMA EV-DO, in order to save notebook clients' time when conducting interoperability tests and obtaining validation from telecom carriers. FIH started shipping the modules earlier this year, the sources indicated.

Currently, Gobi modules have been adopted by Hewlett Packard (HP), Dell, Lenovo and Panasonic in their notebooks, and have received validation from T-Mobile, Verizon, Vodafone and Telefonica.

Qualcomm provides only Gobi chips, produced by Taiwan Semiconductor Manufacturing Company (TSMC) at the 65nm node, to FIH which then makes and sells the modules, Qualcomm is not directly involved in sales of the modules.

Source:digitimes