Japan's NEC Electronics joins IBM on chip project

Updated:2008/9/11 14:50

，Alcatel-Lucent introduces optical monitoring and connectivity features in FTTH system (2008-10-10)

，TRAI considering reductions in interconnection charges (2008-9-23)

，Softbank orders NEC femtocell system (2008-9-23)

，WiMAX to Represent Around 5% of Broadband Connections in Latin America by 2013 (2008-9-23)

，NEC signs cooperation agreement with Telecom Italia (2008-9-18)

，NEC Electronics, Elmos team up on chips (2008-9-17)

，Radiall: The Global Connector Leader in China (2008-9-17)

，DoCoMo picks NEC for ｀Super 3G¨ contract (2008-9-10)

，NTT DoCoMo picks NEC to supply LTE/3G/WLAN equipment (2008-9-9)

，AT&T Expands iPhone Connectivity and Data Offerings. (2008-8-27)

，Bharti, Vodafone, BSNL agree to interconnect with RCOM (2008-8-21)

，GSM cos to interconnect with RCOM (2008-8-21)

，TRAI reaffirms stance on RCOM interconnection (2008-8-19)

，Trai orders GSM operators to interconnect with RCom GSM network (2008-8-18)

，NEC to halt outsourcing of PC output in Japan (2008-8-18)

，NEC Electronics Sales of Graphics Chips to Rise 50% in 3 Years (2008-8-14)

，Quiconnect Partners with Manbujia for Wi-Fi Roaming in China (2008-8-1)

，NEC Says Sales to Carriers Will Rise 43% on Faster Gear Demand (2008-7-30)

，Sri Lanka Telecom connects Lankan Olympians to Beijing (2008-7-24)

，NEC Electronics to swing to profit in Q1 (2008-7-23)