Nokia Siemens Networks has appointed Andrew, the CommScope, Inc. division that is a communications products and systems, to supply its aluminum radio frequency (RF) transmission line cable in India. The deployment of Andrew's HELIAX(R) FXL aluminum cable and related products is part of Nokia Siemens Networks' focus on innovation, in support of a significant wireless network expansion in the Indian market. As a long-time established supplier of Nokia Siemens Networks in India and around the world, Andrew was chosen in part for its site-kitting (b) capabilities and its ability to ship directly from its Goa manufacturing facility.

The HELIAX FXL aluminum cables are easy to install, given their flexible properties that allow for greater bending and minimize tower loading. Compared to competitors' copper cable, HELIAX FXL delivers lower attenuation, higher crush strength and reduced weight. It is environmentally friendly and ROHS (Restriction of Hazardous Substances) compliant--making it more efficient to recycle--and offers a more stable raw material cost.

Furthermore, the patented micro-cell dielectric technology and triple-bonded construction of HELIAX FXL cables reduces the possibility of water ingress, which is believed to be the single biggest reason for cable failure and interruption of site service. These innovations all add up to lower life cycle costs for operators, while ensuring that network performance is at optimum levels.

The HELIAX FXL is part of the HELIAX 2.0 family of wireless transmission line systems from Andrew, the only company to provide a complete line of aluminum cable sizes for wireless networks. HELIAX FXL's lightweight aluminum outer conductor--a first for wireless transmission line cable--is made to exacting specifications that provide the conformability and flexibility necessary for demanding installations without sacrificing electrical, mechanical or environmental performance. HELIAX FXL has a smoothwall design that enhances proper first-time connectorization. The smoothwall design has a triple-bonded architecture with a closed microcell foam dielectric that is nearly watertight once the EZfit connectors are properly installed. 
 
 
 

Source:ecnasiamag