One of China's wireless baseband chipset providers, Spreadtrum Communications, has selected the Verigy Port Scale RF system for production testing of its devices in Suzhou, China. After evaluating multiple competitive solutions, Spreadtrum chose Port Scale RF for its high-throughput and multi-site test capability. Since adopting Port Scale RF, Spreadtrum has lowered its cost-of-test for a high-volume RF device over the incumbent solution.

Spreadtrum manufactures a range of highly integrated baseband processors with robust multimedia functionality and power management for mobile wireless products. Port Scale RF is effective for testing the full range of RF devices, from low-integration chips, such as RF transceivers, to the latest high-integration single-chip devices for next-generation wireless standards. It also gives Spreadtrum flexibility as they implement their RF device roadmap, with performance that covers both next-generation technologies and varying levels of integration. This is achieved in conjunction with faster test times and higher parallelism, which support the lower cost-of-test.

"Verigy’s Port Scale RF solution is unique in the market today for its ability to deliver consistently stable test results, which translates into improved yield. It will help us continue to meet our customers' growing demand for wireless devices," said Brian Chen, Senior Director of Operations, Spreadtrum. "Since 2001, we have been dedicated to growing the wireless communications market in China. We expect to grow our business in RF applications and believe that working with innovative technology leaders like Verigy will be an important factor in our ability to do so."

The Port Scale RF platform provides the measurement capability required to test emerging high-integration semiconductor devices containing integrated RF, mixed-signal, digital, power management, and embedded or stacked memory all with one test system. Verigy claims that Port Scale RF is the only solution for 3G, 4G, and high-integration RF devices qualified for high-volume manufacturing that meets the high multi-site parallel efficiency requirements for these high-volume devices.

Source:Verigy