NTT DoCoMo Inc., Renesas Technology Corp., Fujitsu Ltd, and Sharp Corp. plan to jointly develop the SH-Mobile G4 single-chip LSI device, and a platform incorporating it, to support the HSUPA/HSDPA/W-CDMA and GSM/GPRS/EDGE (2G) mobile telephony standards. Development of the platform is targeted for completion by the fourth quarter of fiscal 2009 (January - March 2010).

The new SH-Mobile G4 will be fabricated with 45nm process technology. It will provide enhanced functionality and improved performance for applications handling HD video and 3-D graphics. In addition to HSDPA cat.8 for extra-fast downlink speeds (7.2Mbps max.), the SH-Mobile G4 will support HSUPA to boost uplink speeds to a maximum of 5.7Mbps, almost 15 times faster than the conventional 384kbps speeds, thereby enabling much faster bidirectional data transfers.

In 2004 NTT DoCoMo and Renesas began joint development work on the SH-Mobile G series of single-chip LSI devices, which integrate a baseband processor that supports dual-mode communication and an application processor. The SH-Mobile G4 will be the fourth product to emerge from this collaboration.

The joint development work by NTT DoCoMo and Renesas on single-chip LSI devices has since progressed to include handset manufacturers such as Fujitsu and Sharp as partners in the development of mobile phone platforms. Each platform has a SH-Mobile G series product as the core component and includes a basic software suite (OS, middleware, and drivers) and a reference chipset in a single package. By using the new platforms, mobile phone manufacturers can eliminate the need to develop basic functions independently, significantly reducing development time and costs. This allows them to invest more time and resources in developing distinctive handset features and expanding their product portfolios.

Source:wirelessdesignasia